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| EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet High Power LED - 0.5W EHP-A09/SUG31-PU5/TR Features Feature of the device: small package with high efficiency Typical view angle: 120 ESD protection. Soldering methods: SMT Grouping parameter: luminous Intensity, wavelength, forward voltage. Typical optical efficiency: 50 lm/W. Thermal resistance (junction to sink): 80 K/W The product itself will remain within RoHS compliant version. Applications Interior automotive lighting (e.g. dashboard backlighting) backlighting (illuminated advertising, general lighting) Signal and symbol luminaries Marker lights (e.g. steps, exit ways, etc.) Scanner Materials Items Reflector Encapsulating Resin Electrodes Die attach Chip Description Heat resistant polymer Colorless clear resin Ag plating Silver paste InGaN Everlight Electronics Co., Ltd. Device No. : DSE-A09-003 http://www.everlight.com Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 1/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR Dimensions N A N Package mark N C N Notes: 1. Dimensions are in millimeters. 2. Tolerances unless dimensions 0.25mm. Everlight Electronics Co., Ltd. Device No. : DSE-A09-003 http://www.everlight.com Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 2/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR Maximum Ratings (T Ambient=25C) Parameter DC Operating Current Pulsed Forward Current ESD Sensitivity Junction Temperature Operating Temperature Storage Temperature Power Dissipation Junction To Heat-Sink Thermal Resistance Symbol IF IF ESD Tj Topr Tstg Pd Rth Rating 150 300 2000 125 -40 ~ +100 -40 ~ +100 1 80 Unit mA mA V C C C W K/W Electro-Optical Characteristics (TAmbient=25C) Parameter Bin C2 D1 Luminous Intensity(1) D2 E1 E2 G1 Wavelength(2) G2 G3 V2 Forward Voltage(3) V3 V4 Viewing Angle(4) ---21/2 VF d Iv Symbol Min 3550 4500 5600 7100 9000 520 525 530 3.25 3.55 3.85 ---Typ. ---------------------------------120 Max 4500 5600 7100 9000 11200 525 530 535 3.55 3.85 4.15 ---deg V nm IF=150mA mcd Unit Condition Note. 1. Luminous Intensity measurement tolerance: 10% 2. Wavelength measurement tolerance : 1nm 3. Forward Voltage measurement tolerance: 0.1V 4. 21/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. Everlight Electronics Co., Ltd. Device No. : DSE-A09-003 http://www.everlight.com Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 3/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR Typical Electro-Optical Characteristics Curves Relative Spectral Distribution, IF=150mA, T Ambient=25C 1.0 3.8 Forward Voltage vs Forward Current, T Ambient=25C Relative Luiminous Intensity 0.8 3.6 Forward Voltage (V) 0.6 3.4 3.2 0.4 3.0 0.2 2.8 0.0 400 450 500 550 600 650 700 0 50 100 150 200 250 300 Wavelength(nm) Forward Current (mA) Relative Luminous Intensity vs Forward Current, T Ambient=25C Ambient Temperature & Operating Current Derating based on TJMAX = 125 1.6 250 Relative Luminous Intensity 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 50 100 150 200 250 300 Forward Current (mA) 200 150 100 50 0 20 Forward Current (mA) Ambient Temperature (C) 40 60 80 100 120 140 160 Everlight Electronics Co., Ltd. Device No. : DSE-A09-003 http://www.everlight.com Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 4/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR Typical Representative Spatial Radiation Pattern 1.0 Relative Luminous Intensity 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -80 -60 -40 -20 0 20 40 60 80 Degree (2) Everlight Electronics Co., Ltd. Device No. : DSE-A09-003 http://www.everlight.com Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 5/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR Label explanation CPN: Customer's Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks HUE: Domain Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production Place Reel Dimensions Note: 1. Dimensions are in millimeters. 2. The tolerances unless mentioned is 0.1mm. Everlight Electronics Co., Ltd. Device No. : DSE-A09-003 http://www.everlight.com Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 6/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR Carrier Tape Dimensions: Loaded quantity 1000 PCS per reel Package mark Note: 1. Dimensions are in millimeters. 2. The tolerances unless mentioned is 0.1mm. Moisture Resistant Packaging Label Aluminum moisture-proof bag Desiccant Label Everlight Electronics Co., Ltd. Device No. : DSE-A09-003 http://www.everlight.com Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 7/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR Reliability Test Items Stress Test Stress Condition Stress Duration Reflow DC Operating Life High Temperature Storage High Temperature Operation Life #1 High Temperature Operation Life #2 Tsol=260C, 10sec, 6min(total) Ta=25C , IF=150mA Ta=100C Ta=55C, IF=150mA Ta=85, IF=120mA Ta=-40C Ta=85 , RH=85% Ta=85C , RH=60%, IF=120mA H100C 15min. 2 times 1000 hours 1000 hours 1000 hours 1000hours 1000 hours 1000hours 1000 hours Low Temperature Storage High Temperature/ Humidity Reverse Bias High Temperature/ Humidity Operation Life Temperature Cycle ' 5min. 'L40C 15min. H85C 15min. ' 5min. 'L40C 15min. H110C 5min. ' 10sec. 'L40C 5min. Ta=25, IF=1000mA 30mS on/ 2500mS off 2000V, Interval:0.5sec 200V, Interval:0.5sec 300 Cycles Power Temperature Cycle 1000 Cycles Thermal Shock 300 Cycles Pulse Test ESD Human Body Model ESD Machine Model 30000 times 3 times 3 times *lm: Brightness attenuate difference(1000hrs)50% *VF: Forward voltage difference20% Notes: All reliability items are tested under superior thermal management with 1.5 x 1.5 cm2 MCPCB. Everlight Electronics Co., Ltd. Device No. : DSE-A09-003 http://www.everlight.com Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 8/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR Precautions For Use 1. Over-current-proof Though EHP-A09 has conducted ESD protection mechanism, customers must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage difference may cause enormous current shift and burn out failure would happen. 2. Storage i. ii. iii. iv. v. vi. Do not open the moisture proof bag before the devices are ready to use. Before the package is opened, LEDs should be stored at temperature less than 30and humidity less than 90%. LEDs should be used within a year. After the package is opened, LEDs should be stored at temperature less than 30and humidity less than 70%. LEDs should be used within 168 hours (7 days) after the package is opened. If the moisture absorbent material (silicone gel) has faded away or LEDs have exceeded the storage time, baking treatment should be implemented based on the following the conditions: pre-curing at 605 for 24 hours. 3. Thermal Management i. For maintaining the high flux output and achieving reliability, EHP-A09 series LEDs should be mounted on a metal core printed circuit board (MCPCB) or other kinds of heat sink with proper thermal connection to dissipate approximate 0.5W of thermal energy at 150mA operation. ii. Special thermal designs are also recommended to take in heat dissipation management, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc. iii. Sufficient thermal management must be implemented. Otherwise, the junction temperature of dies might be over the limit at high current driving condition and LEDs' lifetime might be decreases dramatically. iv. For further thermal management suggestions, please consult Everlight Design Guide or local representatives for assistance. Everlight Electronics Co., Ltd. Device No. : DSE-A09-003 http://www.everlight.com Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 9/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/SUG31-PU5/TR 4. Soldering Condition 4-1. For Reflow process i. ii. EHP-A09 series are suitable for SMT process. Lead reflow soldering temperature profile iii. iv. v. Reflow soldering should not be done more than two times. In soldering process, stress on the LEDs during heating should be avoided. After soldering, do not warp the circuit board. Everlight Electronics Co., Ltd. Device No. : DSE-A09-003 http://www.everlight.com Prepared date: Sept. 06, 2007 Rev. 1.0 Page: 10/10 Prepared by: Terry Hsu |
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